Optical element driving mechanism

ABSTRACT

An optical element driving mechanism is provided, including a fixed part, a movable part and a driving assembly. The fixed part has a main axis, includes an outer frame and a base. The outer frame has a top surface and a sidewall. The top surface intersects the main axis. The sidewall extends from the edge of the top surface along the main axis. The base includes a base plate intersecting the main axis and securely connected to the outer frame. The movable part moves relative to the fixed part, and connects to an optical element having an optical axis. The driving assembly drives the movable part to move relative to the fixed part. The main axis is not parallel to the optical axis.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of pending U.S. patent applicationSer. No. 16/750,276, filed Jan. 23, 2020 and entitled “OPTICAL ELEMENTDRIVING MECHANISM”, which claims priority to European Patent ApplicationNo. 19218896.9, filed on 20 Dec. 2019, the entirety of which isincorporated by reference herein.

BACKGROUND OF THE INVENTION Field of the Invention

The present disclosure relates to an optical element driving mechanism,and more particularly to an optical element driving mechanism of anelectrical device.

Description of the Related Art

As the relevant technologies have developed, many electronic devices(such as cameras and smartphones) can record images and videos. However,when a lens having a long focal length is provided in an electronicdevice, the thickness thereof may be increased, impeding the prospectsfor miniaturization of the electronic device. Therefore, an opticalelement driving mechanism capable of aiding in the miniaturization ofthe electrical device is an important issue.

BRIEF SUMMARY OF THE INVENTION

To solve the problems of the prior art, an optical element drivingmechanism is provided, including a fixed part, a movable part and adriving assembly. The fixed part has a main axis, includes an outerframe and a base. The outer frame has a top surface and a sidewall. Thetop surface intersects the main axis. The sidewall extends from the edgeof the top surface along the main axis. The base includes a base plateintersecting the main axis and securely connected to the outer frame.The movable part moves relative to the fixed part, and connects to anoptical element having an optical axis. The driving assembly drives themovable part to move relative to the fixed part. The main axis is notparallel to the optical axis.

In one of the embodiments of the present disclosure, the top surface hasan unequal long side and a short side when observed along the main axis,and the optical axis is parallel to the extending direction of the shortside. The driving assembly is used for driving the movable part to movealong the optical axis relative to the fixed part. The driving assemblyfurther includes a driving magnetic element and a driving coil assembly,the driving coil assembly includes a circuit board and a driving coildisposed at the circuit board. The base further includes a circuit boardpositioning structure, the circuit board further includes a coilpositioning structure, the coil positioning structure has a recess or anopening structure, and the coil positioning structure corresponds to thecircuit board positioning structure. The circuit board further includesa plurality of coil positioning structures, disposed at two sides of thecircuit board.

In one of the embodiments of the present disclosure, the driving coilassembly further includes a plurality of driving coils disposed in thecircuit board, and the driving coils are arranged along the opticalaxis. The top surface has an unequal long side and a short side whenobserved along the main axis, and the optical axis is parallel to theextending direction of the short side, the arrangement direction of thedriving coils is parallel to the extending direction of the short side.The optical element driving mechanism further includes a circuitassembly electrically connected to the driving coil assembly, whereinthe circuit assembly includes a coil electrical connection part disposedbetween a first circuit board surface of the circuit board and a firstcircuit surface of the circuit assembly, the first circuit board surfacefaces the circuit assembly and the first circuit surface faces thecircuit board, the coil electrical connection part at least partiallyoverlaps the first circuit board surface and the first circuit surfacewhen observed along the main axis, and the circuit board is electricallyconnected to the circuit assembly via the coil electrical connectionpart. The circuit board further includes a second circuit board surfacefacing opposite the first circuit board surface, the circuit assemblyfurther includes a second circuit surface facing opposite the firstcircuit surface, the coil electrical connection part is not provided onthe second circuit board surface or the second circuit surface, the coilelectrical connection part at least partially overlaps the secondcircuit board surface and the second circuit surface when observed alongthe main axis.

In one of the embodiments of the present disclosure, the optical elementdriving mechanism further includes a circuit assembly electricallyconnected to the driving coil assembly and disposed at the base, whereinthe circuit assembly includes a first section and a second section, thefirst section is electrically connected to the second section via aconnecting circuit of the circuit board. The driving coil does notoverlap the connecting circuit when observed in the directionperpendicular to the main axis, and the greatest size of the drivingcoil is different from the greatest size of the connecting circuit alongthe main axis.

In one of the embodiments of the present disclosure, the optical elementdriving mechanism further includes a circuit assembly electricallyconnected to the driving coil assembly and disposed at the base, whereinthe base further includes a first opening, and the circuit assemblyincludes a first embedded part, a first exposed part, a second embeddedpart and a second exposed part. The first embedded part is embedded inthe base and is not exposed. The first exposed part is electricallyconnected to the first embedded part and is exposed to the firstopening. The second embedded part is embedded in the base and is notexposed. The second exposed part is electrically connected to the secondembedded part and is exposed to the first opening. The first exposedpart is electrically independent from the second exposed part. Thecircuit assembly further includes a third exposed part partially exposedto a second opening of the base, and the second opening does notaccommodate other circuits that are electrically independent from thethird exposed part. The base further includes a plurality of recessesdisposed at two sides of the first opening. The circuit board at leastpartially overlaps the first opening when observed along the main axis.

In one of the embodiments of the present disclosure, the base furtherincludes a recess, a surface of the first exposed part, a surface of thesecond exposed part and a recess surface of the recess are located on asame imaginary plane. The first opening further includes a first openingside in contact with the recess surface, but the first opening side andthe recess surface are not parallel to each other, the first exposedpart and the second exposed part at least partially exposed to the firstopening side. The optical element driving mechanism further includes anadhesive element disposed between the circuit board and the base, andthe adhesive element at least partially overlaps the first opening whenobserved along the main axis. The adhesive element at least partiallyoverlaps the first opening when observed in the direction perpendicularto the main axis.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention can be more fully understood by reading the subsequentdetailed description and examples with references made to theaccompanying drawings, wherein:

FIG. 1 shows a schematic view of an electrical device with an opticalelement driving mechanism according to an embodiment of the presentdisclosure.

FIG. 2 shows a schematic view of the optical element driving mechanismand a prism module according to an embodiment of the present disclosure.

FIG. 3 shows a perspective view of the optical element driving mechanismand an optical element according to an embodiment of the presentdisclosure, wherein an outer frame of the optical element drivingmechanism is shown as a dashed line.

FIG. 4 shows an exploded view of the optical element driving mechanismaccording to an embodiment of the present disclosure.

FIG. 5 shows a schematic view of a base, a circuit board, a drivingmagnetic element and a circuit assembly of the optical element drivingmechanism according to an embodiment of the present disclosure.

FIG. 6 shows a schematic view of a driving coil and a connecting circuitof the circuit assembly of the optical element driving mechanismaccording to an embodiment of the present disclosure.

FIG. 7A shows a schematic view of the base, the circuit assembly and thecircuit board of the optical element driving mechanism according to anembodiment of the present disclosure.

FIG. 7B shows a bottom view of a circuit and the circuit board of theoptical element driving mechanism according to an embodiment of thepresent disclosure.

FIG. 7C shows a side view of the circuit assembly and the circuit boardof the optical element driving mechanism according to an embodiment ofthe present disclosure.

FIG. 8A shows a partial schematic view of the base, the circuitassembly, the circuit board and an adhesive element of the opticalelement driving mechanism according to an embodiment of the presentdisclosure, wherein the base and the circuit board are shown as a dashedline.

FIG. 8B shows a partial enlarged view of the base, the circuit assemblyand the adhesive element of the optical element driving mechanismaccording to an embodiment of the present disclosure, wherein the baseis shown as a dashed line.

FIG. 9 shows a schematic view of the base, the circuit board and theadhesive element of the optical element driving mechanism according toan embodiment of the present disclosure.

FIG. 10 shows a schematic view of the base and the circuit assembly ofthe optical element driving mechanism according to an embodiment of thepresent disclosure.

FIG. 11 shows a schematic view of a first segment and a second segmentof the circuit assembly and the connecting circuit of the opticalelement driving mechanism according to an embodiment of the presentdisclosure.

DETAILED DESCRIPTION OF THE INVENTION

The making and using of optical element driving mechanisms ofembodiments of the present disclosure are discussed in detail below. Itshould be appreciated, however, that the embodiments provide manyapplicable inventive concepts that can be embodied in a wide variety ofspecific contexts. The specific embodiments discussed are merelyillustrative of specific ways to make and use the embodiments and do notlimit the scope of the disclosure.

Unless defined otherwise, all technical and scientific terms used hereinhave the same meaning as commonly understood by one of ordinary skill inthe art to which this invention belongs. It should be appreciated thateach term, which is defined in a commonly used dictionary, should beinterpreted as having a meaning conforming to the relative skills andthe background or the context of the present disclosure, and should notbe interpreted in an idealized or overly formal manner unless definedotherwise.

Firstly, please refer to FIG. 1 , an optical element driving mechanism11-100 of an embodiment of the present disclosure may be mounted in anelectrical device 11-1 for taking photos or videos, wherein theaforementioned electrical device 11-1 may, for example, be a smartphoneor a digital camera, but the present disclosure is not limited to these.It should be noted that the position and the size between the opticalelement driving mechanism 11-100 and the electrical device 11-1 shown inFIG. 1 are only an example, which is not for limiting the position andthe size between the optical element driving mechanism 11-100 and theelectrical device 11-1. In fact, according to different needs, theoptical element driving mechanism 11-100 may be mounted at differentpositions in the electrical device 11-1.

Please refer to FIG. 2 , the optical element driving mechanism 11-100carries an optical element 11-110 with an optical axis 11-O. A prismmodule 11-200 may be disposed outside of the optical element drivingmechanism 11-100. The prism module 11-200 is located at the upstream ofthe light entry of the optical element driving mechanism 11-100. A light11-L incident to a prism 11-210 of the prism module 11-200, and thenreflected by the prism 11-210 to an optical path 11-H, and passingthrough the optical element 11-110 for imaging.

Please refer to FIG. 3 , the optical element driving mechanism 11-100includes a movable part 11-10, a fixed part 11-20, a driving assembly11-30, a circuit assembly 11-40 and an adhesive element 11-50 (pleaserefer to FIG. 4 ). The adhesive element 11-50 may be the material of asoldering tin or a glue for fixing and securing.

As shown in FIG. 3 , the movable part 11-10 is in contact with theoptical element 11-110. The movable part includes a holder 11-11. Pleaserefer to FIG. 4 , the holder 11-11 of the movable part 11-10 has ahollow ring structure, and has a through hole 11-11 a and a threadedstructure 11-11 b formed on the through hole 11-11 a, and the opticalelement 11-110 may be locked in the through hole 11-11 a via thethreaded structure 11-11 b.

Please refer to FIG. 3 again, the fixed part 11-20 includes an outerframe 11-21 and a base 11-22, and the fixed part 11-20 has a main axis11-M. The main axis 11-M is not parallel to the optical axis 11-O. Inthe present embodiment, the main axis 11-M is perpendicular to theoptical axis 11-O. The outer frame 11-21 has four sidewalls 11-21 a anda top surface 11-21 b. The sidewall 11-21 a extends from an edge 11-21b′ of the top surface 11-21 b along the main axis 11-M. That is, thesidewall 11-21 a is significantly parallel to the main axis 11-M. Thetop surface 11-21 b intersects with the main axis 11-M, morespecifically, the main axis 11-M perpendicularly penetrates the topsurface 11-21 b. The top surface 11-21 b has a long side 11-21 b″ and ashort side 11-21 b′″. The extending direction of the short side 11-21b′″ is parallel to the optical axis 11-O, while the extending directionof the long side 11-21 b″ is not parallel to the optical axis 11-O.Please refer to FIGS. 3 and 4 at the time, the base 11-22 includes abase plate 11-221, four circuit board positioning structures 11-222, afirst opening 11-223, a second opening 11-224 and a plurality of recess11-225. The base plate 11-221 intersects the main axis 11-M, andsecurely connects to the outer frame 11-21.

Please refer to FIG. 4 , the driving assembly 11-30 includes two drivingmagnetic elements 11-31 and a driving coil assembly 11-32. The drivingassembly 11-30 may drive the movable part 11-10 to move relative to thefixed part 11-20, and the driving assembly 11-30 is electricallyconnected to the circuit assembly 11-40. The driving coil assembly 11-32has two circuit boards 11-321 and four driving coils 11-322. The circuitboard 11-321 includes a first circuit board surface 11-321 a, a secondcircuit board surface 11-321 b, two coil positioning structures 11-321 cand a connecting circuit 11-321 d.

Please refer to FIG. 3 , the circuit assembly 11-40 is disposed in thebase 11-22 of the fixed part 11-20. The circuit assembly 11-40 includesa plurality of circuits 11-41. The circuit 11-41 has a first circuitsurface 11-411 and a second circuit surface 11-412.

Please refer to FIG. 5 , the circuit board 11-321 is disposed on thebase plate 11-221, and the driving magnetic element 11-31 is disposedabove the circuit board 11-321. Four driving coils 11-322 are disposedin the circuit boards 11-321 respectively, and the driving coils 11-322are corresponding to the driving magnetic elements 11-31. It should benoted that the driving coils is not limited to be four. In someembodiments, there may by one, two, three or more driving coils 11-322.The driving coil 11-322 may generate an electromagnetic driving force todrive the holder 11-11 of the movable part 11-10 to move along theoptical axis 11-O relative to the fixed part 11-20 when a current isapplied to the driving coil 11-322. The first circuit board surface11-321 a of the circuit board 11-321 faces the circuit 11-41 of thecircuit assembly 11-40, and the second circuit board surface 11-321 bfaces opposite the first circuit board surface 11-321 a (please alsorefer to FIG. 9 ).

As shown in FIG. 5 , two coil positioning structures 11-321 c of eachcircuit boards 11-321 have a recess or an opening structure, and thecoil positioning structures 11-321 c are located at the opposite sidesof the circuit boards 11-321 c. The circuit board positioning structure11-222 of the base 11-22 of the fixed part 11-20 corresponds to the coilpositioning structure 11-321 c, and the circuit board positioningstructure 11-222 is located in the recess of the coil positioningstructure 11-321 c to prevent the circuit board 11-321 and the drivingcoil 11-322 in the circuit board 11-321 from moving relative to the base11-22 during impact. It should be noted that the circuit board 11-321 isnot limited to be two, and the coil positioning structure 11-321 c andthe circuit board positioning structure 11-222 are not limited to befour. In some embodiments, there may be one, three, or more circuitboards 11-321, and there may be one, two, three, five, or more coilpositioning structures 11-321 c and the circuit board positioningstructures 11-222. Moreover, the positions of the coil positioningstructures 11-321 c are not limited to the opposite sides of the circuitboard 11-321. In some embodiments, the coil positioning structures11-321 c may be located at any one side, any two sides, any three sides,or any four sides of the circuit board 11-321 c.

Please refer to FIG. 6 , the driving coil 11-322 is arranged along theoptical axis 11-O, that is, the direction along which the driving coil11-322 is arranged is parallel to the extending direction of the shortside 11-21 b′″ (please refer to FIG. 3 , the sort side 11-21 b′″ isparallel to the optical axis 11-O). The circuit board 11-321 furtherincludes a connecting circuit 11-321 d. The driving coil 11-322 does notoverlap the connecting circuit 11-321 d when observed in the directionperpendicular to the main axis 11-M. In the present embodiment, thedriving coil 11-322 does not overlap the connecting circuit 11-321 dwhen observed along the optical axis 11-O (in the present embodiment,the optical axis 11-O is perpendicular to the main axis 11-M). Inaddition, along the main axis 11-M, a greatest size 11-S2 of the drivingcoil 11-322 is different from a greatest size 11-S1 of the connectingcircuit 11-321 d. Specifically, along the main axis 11-M, the greatestsize 11-S1 of the connecting circuit 11-321 d is smaller than thegreatest size 11-S2 of the driving coil 11-322, so that the connectingcircuit 11-321 d has a lower resistance.

Please refer to FIGS. 7A-7C, the first circuit surface 11-411 of thecircuit 11-41 faces towards the circuit board 11-321, and the secondcircuit surface 11-412 faces opposite the first circuit surface 11-411.The circuit 11-41 may have a coil electrical connection part 11-413. Thecircuit board 11-321 is electrically connected to the circuit 11-41 ofthe circuit assembly 11-40 via the coil electrical connection part11-413. The coil electrical connection part 11-413 is disposed betweenthe first circuit board surface 11-321 a of the circuit board 11-321 andthe first circuit surface 11-411 of part of the circuit 11-41. The coilelectrical connection part 11-413 at least partially overlaps the firstcircuit board surface 11-321 a and the first circuit surface 11-411 whenobserved along the main axis 11-M. It should be noted that no coilelectrical connection part 11-413 is provided on the second circuitboard surface 11-321 b of the circuit board 11-321 and the secondcircuit surface 11-412 of the circuit 11-41. Moreover, the coilelectrical connection part 11-413 at least partially overlaps the secondcircuit board surface 11-321 b and the second circuit surface 11-412when observed along the main axis 11-M.

Please refer to FIGS. 8A and 8B, FIG. 8A is a partial schematic view ofthe base 11-22, the circuit assembly 11-40, the circuit board 11-321 andthe adhesive element 11-50, and FIG. 8B is a partial enlarged view ofthe base 11-22, the circuit assembly 11-40 and the adhesive element11-50. As shown in FIGS. 8A and 8B, the circuit 11-41 may furtherinclude a first embedded part 11-414, a first exposed part 11-415, asecond embedded part 11-416, and second exposed part 11-417 and a thirdexposed part 11-418. The first embedded part 11-414 is embedded in thebase 11-22 of the fixed part 11-20 and is not exposed. The first exposedpart 11-415 is electrically connected to the first embedded part 11-414and is exposed to the first opening 11-223 of the base 11-22. The secondembedded part 11-416 is embedded in the base 11-22 and is not exposed.The second exposed part 11-417 is electrically connected to the secondembedded part 11-416 and is exposed to the first opening 11-223. Inaddition, the first embedded part 11-414 and the first exposed part11-415 are electrically independent from the second embedded part 11-416and the second exposed part 11-417. That is, the first opening 11-223accommodates two circuits that are electrically independent from eachother, rather than arranging the two circuits that are electricallyindependent from each other separately. In this way, processing andmanufacturing of the optical element driving mechanism 11-100 may befacilitated, and the effect of miniaturization may be achieved.

As shown in FIG. 8A, the third exposed part 11-418 is partially exposedto the second opening 11-224 of the base 11-22, and the second opening11-224 does not accommodate other circuits that are electricallyindependent from the third exposed part 11-418. The functions of thesecond opening 11-224 are not totally the same as that of the firstopening 11-223. The second opening 11-224 may improve the heatdissipation efficiency of the third exposed part 11-418 to avoid theelements of the optical element driving mechanism 11-100 fromoverheating. Moreover, the second opening 11-224 may facilitate theprocessing and manufacturing of the optical element driving mechanism11-100, and keep the third exposed part 11-418 at a desired position.

Please continue to refer to FIGS. 8A and 8B, the first exposed part11-415 and the second exposed part 11-417 have a surface 11-415 a and asurface 11-417 a respectively, and the recess 11-225 of the base 11-22has a recess surface 11-225 a. The surface 11-415 a of the first exposedpart 11-415, the surface 11-417 a of the second exposed part 11-417 andthe recess surface 11-225 a are located on a same imaginary plane 11-P.The first opening 11-223 further includes a first opening side 11-223 a,the first opening side 11-223 a is in contact with the recess surface11-225 a, but the first opening side 11-223 a and the recess surface11-225 a are not parallel to each other. The first exposed part 11-415and the second exposed part 11-417 are partially exposed to the firstopening side 11-223 a.

As shown in FIGS. 8A and 8B, the adhesive element 11-50 at leastpartially overlaps the first opening 11-223 when observed along the mainaxis 11-M. The adhesive element 11-50 here may be glue instead ofsoldering tin. Moreover, the adhesive element 11-50 at least partiallyoverlaps the first opening 11-223 when observed in the directionperpendicular to the main axis 11-M. That is, the adhesive element 11-50is disposed at the first opening 11-223 to fix and protect the firstexposed part 11-415 and the second exposed part 11-417. In addition, thecircuit board 11-321 at least partially overlaps the first opening11-223 when observed along the main axis 11-M. In this way, the circuitboard 11-321 may shield the first opening 11-223, and further preventforeign matters such as dust from entering the first opening 11-223.

As shown in FIG. 9 , the adhesive element 11-50 of the optical elementdriving mechanism 11-100 is disposed between the circuit board 11-321and the base 11-22, and the adhesive element 11-50 here may be solderingtin 11-50. It should be noted that, in some embodiments, the solderingtin 11-50 is only disposed between the circuit board 11-321 and the base11-22. That is, the soldering tin 11-50 at least partially overlaps thecircuit board 11-321 and the base 11-22 when observed along the mainaxis 11-M. However, the soldering tin 11-50 does not overlap the circuitboard 11-321 and the base 11-22 when observed in the directionperpendicular to the main axis.

Please refer to FIG. 10 , two sides of the first opening 11-223 of thebase 11-22 may be provided with the recesses 11-225. In this way, thefirst exposed part 11-415 and the second exposed part 11-417 in thefirst opening 11-223 may be more securely connected to (or electricallyconnected to) other elements of the optical element driving mechanism11-100 in the recess 11-225. In addition, since the first exposed part11-415 and the second exposed part 11-417 are partially exposed to thefirst opening side 11-223 a, the heat dissipation efficiency of thefirst exposed part 11-415 and the second exposed part 11-417 isincreased to prevent the elements from overheating.

Please refer to FIG. 11 , the circuit 11-41 may further include a firstsection 11-41 a and a second section 11-41 b. The first section 11-41 ais electrically connected to the second section 11-41 b via theconnecting circuit 11-321 d of the circuit board 11-321. Morespecifically, the first section 11-41 a is electrically connected to theconnecting circuit 11-321 d, and the connecting circuit 11-321 d iselectrically connected to the second section 11-41 b. In this way, thefirst section 11-41 a and the second section 11-41 b may avoid thetwo-dimensional restriction by means of three-dimensional electricallyconnection (in the direction of the main axis 11-M), and the degrees offreedom for routing is increased.

In summary, the circuit assembly 11-40 of the optical element drivingmechanism 11-100 is disposed in the base 11-22. That is, the opticalelement driving mechanism 11-100 of the present disclosure has thefeature of circuit embedment. In this way, the optical element drivingmechanism 11-100 may be integratedly manufactured, so that the structureof the optical element driving mechanism 11-100 is strengthened and thenumber of elements required by the optical element driving mechanism11-100 is reduced, thereby achieving miniaturization of the opticalelement driving mechanism 11-100. The circuit embedment of the opticalelement driving mechanism 11-100 of the present disclosure not only hasthe above-mentioned functions, but also enables the embedded circuit toreceive current, so that the circuit may be used as an electric circuit.In this way, the routing of the optical element driving mechanism 11-100may be facilitated, and the optical element driving mechanism 11-100does not require additional circuit assemblies, thereby achieving theeffect of facilitating manufacturing and miniaturization.

Although embodiments of the present disclosure and their advantages havebeen described in detail, it should be understood that various changes,substitutions and alterations can be made herein without departing fromthe spirit and scope of the disclosure as defined by the appendedclaims. For example, it will be readily understood by those skilled inthe art that many of the features, functions, processes, and materialsdescribed herein may be varied while remaining within the scope of thepresent disclosure. Moreover, the scope of the present application isnot intended to be limited to the particular embodiments of the process,machine, manufacture, composition of matter, means, methods and stepsdescribed in the specification. As one of ordinary skill in the art willreadily appreciate from the disclosure of the present disclosure,processes, machines, manufacture, compositions of matter, means,methods, or steps, presently existing or later to be developed, thatperform substantially the same function or achieve substantially thesame result as the corresponding embodiments described herein may beutilized according to the present disclosure. Accordingly, the appendedclaims are intended to include within their scope such processes,machines, manufacture, compositions of matter, means, methods, or steps.In addition, the scope of the present disclosure is defined by the scopeof the appended claims. In addition, each scope of the claims isconstructed as a separate embodiment, and various combinations of theclaims and combinations of embodiments are within the scope of thepresent disclosure.

What is claimed is:
 1. An optical element driving mechanism, comprising:a movable part, for connecting to an optical element; a fixed part,wherein the movable part being movable relative to the fixed part,wherein the fixed part comprises a base having a plate-like structure,and the base is perpendicular to a main axis; a driving assembly, fordriving the movable part to move relative to the fixed part; and acircuit assembly, electrically connected to the driving assembly,comprising: a first embedded part, having a plate-like structure and notexposed to the base; a first exposed part, electrically connected to thefirst embedded part and exposed to a first opening of the base; a secondembedded part, having a plate-like structure and not exposed to thebase; a second exposed part, electrically connected to the secondembedded part and exposed to the first opening; and a first electricalconnection part, having a plate-like structure and electricallyconnected to the driving assembly, wherein the first embedded part andthe first electrical connection part are parallel to each other, whereina first surface of the first embedded part does not overlap a secondsurface of the first electrical connection part when viewed alongarbitrary directions that are perpendicular to the main axis, and thefirst surface and the second surface face the same direction.
 2. Theoptical element driving mechanism as claimed in claim 1, wherein thefirst electrical connection part does not overlap the first opening whenviewed along the main axis.
 3. The optical element driving mechanism asclaimed in claim 1, wherein a third surface of the second embedded partdoes not overlap a second surface of the first electrical connectionpart when viewed along the main axis.
 4. The optical element drivingmechanism as claimed in claim 3, wherein the first surface of the firstembedded part and the third surface of the second embedded part arelocated on a same imaginary plane.
 5. The optical element drivingmechanism as claimed in claim 4, wherein the second surface of the firstelectrical connection part is not located on the imaginary plane.
 6. Theoptical element driving mechanism as claimed in claim 1, wherein thesecond electrical connection part does not overlap the first openingwhen viewed along the main axis.
 7. The optical element drivingmechanism as claimed in claim 1, wherein the first exposed part iselectrically independent from the second exposed part.
 8. The opticalelement driving mechanism as claimed in claim 1, wherein the firstelectrical connection part is not exposed to the base.
 9. The opticalelement driving mechanism as claimed in claim 1, wherein the firstelectrical connection part at least partially extends along the mainaxis.
 10. The optical element driving mechanism as claimed in claim 1,wherein the second surface of the first electrical connection part isperpendicular to the main axis.
 11. The optical element drivingmechanism as claimed in claim 1, wherein the first surface of the firstembedded part does not overlap the second surface of the firstelectrical connection part when viewed along the main axis.
 12. Theoptical element driving mechanism as claimed in claim 1, wherein thefirst surface of the first embedded part is exposed to the base.
 13. Theoptical element driving mechanism as claimed in claim 1, wherein thecircuit assembly further comprises a third exposed part partiallyexposed to a second opening of the base, and the second opening does notaccommodate other circuits that are electrically independent from thethird exposed part.
 14. The optical element driving mechanism as claimedin claim 1, wherein the base further comprises a plurality of recessesdisposed at two sides of the first opening.
 15. The optical elementdriving mechanism as claimed in claim 1, wherein the base furthercomprises a recess, a surface of the first exposed part, a surface ofthe second exposed part and a recess surface of the recess are locatedon a same imaginary plane.
 16. The optical element driving mechanism asclaimed in claim 15, wherein the first opening further comprises a firstopening side in contact with the recess surface, but the first openingside and the recess surface are not parallel to each other, the firstexposed part and the second exposed part are at least partially exposedto the first opening side.
 17. The optical element driving mechanism asclaimed in claim 1, wherein the driving assembly further comprises adriving magnetic element and a driving coil assembly, and the drivingcoil assembly comprises a circuit board and a driving coil disposed atthe circuit board.
 18. The optical element driving mechanism as claimedin claim 17, wherein the circuit board at least partially overlaps thefirst opening when viewed along the main axis.
 19. The optical elementdriving mechanism as claimed in claim 17, further comprising an adhesiveelement disposed between the circuit board and the base, wherein theadhesive element at least partially overlaps the first opening whenviewed along the main axis.
 20. The optical element driving mechanism asclaimed in claim 19, wherein the adhesive element at least partiallyoverlaps the first opening when viewed in the direction perpendicular tothe main axis.